3D Stacked Package Technology and Its Application Prospects

摘要

In recent years, the increasing demands for the high performance integrated circuit devices have led to the development of multi-die stacked technology in a single package form. The 3D (three dimension) stacked package technology is developing trend of the integrated circuit advanced high-density packaging, which can easily meet the developing of smaller footprint, lower profile, multi-function, lower power consumption and lower cost for the cell phones and consumer products like digital cameras, MP4, PDA and other wireless devices. Some correlative concepts of the 3D stacked package have been proposed in this paper. Firstly, the development trends and the general classifications of 3D stacked package have been introduced. Furthermore, in order to compare with the traditional 2D package (MCM), the advantages of the 3D stacked package technology have been discussed, and it also briefly states the technical challenges that 3D stacked package technology must be faced. In addition, the potential applications that may take advantage of 3D stacked package technology are discussed in the end.