Dynamic Mechanical and Dielectric Relaxation Behavior of Chitosan Films: Influence of Water Content

摘要

The dynamic mechanical dielectric behavior of neutralized chitosan films has been investigated as a function of water content and temperature. Chitosan films exhibit three relaxation processes in the low frequency range: the first one between 86-102°C, it corresponds to the a-relaxation process and shifts to higher temperatures with decreasing water content; a second relaxation was observed from 8°C to the onset of thermal degradation (240°C) and it is identified as the a-relaxation often associated with proton mobility; and a third relaxation process in the 240-300°C temperature range that corresponds to chitosan thermal degradation.