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Nonsuperconducting Micron Size Particle asEffective Pinning Centre for Enhanced J_c in High-T_c Superconductors

机译:用于高T_C超导体的增强型J_C的非对微米尺寸粒子A曝光钉钉循环中心

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Understanding the real mechanism responsible for achieving high transport criticalcurrent density (J_c) in the high temperature (high-T_c) cuprate superconductors has been one of theprimary goal. The only promising way is to tailor the high-Tc cuprate material during preparationstage incorporating suitable non-superconducting particles within superconducting matrix, whichare known to serve as effective pining centers . Incorporation of non-superconducting particle likesilver with dimension down to micron/submicron size in the superconducting matrix is very stableand form a homogenous solid solution matrix, which has got the better stability on aging and foundto be effective in enhancing flux pining in high-Tc superconducting system. In this paper , studieshave been made to investigate and review the effect of non-superconducting micron size Agparticle in to the matrix of RE-Ba-Cu-O ( RE = Sm,Gd & Y ) 123 high –Tc ceramicsuperconducting system . XRD, SEM, magnetization, magnetotransport and microwave induce DCvoltage measurements were carried out to study the effect of Ag into 123- superconducting system.It is observed that controlled addition of Ag into Sm-Ba-Cu-O ( SBCO ) , Gd-Ba-Cu-O ( GBCO )and Y-Ba-Cu-O ( YBCO ) ceramic superconductor do not react with the decomposed phases butremains in the metallic form. This brings about a lowering of the normal-state resistivity . Theincrease of magnetic critical current density (Jmc ) ,transport critical current density ( Jtc ) , and,hence pinning force density ( F_p )with Ag addition into above three systems suggest the creationof an SNS-type proximity junction at the intergranular region and stronger Josephson current pathsbetween the superconducting intergrains. This is attributed to the physical densification andconsequent reduction of the total number of weak links by Ag addition into the above mentionedceramic superconducting system.
机译:了解负责在高温(HIGH-T_C)铜替代超导体中实现高运输关键频流密度(J_C)的实际机制是其三种目标之一。唯一有希望的方法是在制备在超导基质中加入合适的非超导颗粒的制备期间定制高TC铜酸材料,以至于已知用作有效的松续中心。在超导基质中将非超导颗粒呈含量掺入微导粒子/亚微米尺寸的尺寸是非常稳定的固体溶液基质,其在老化的稳定性上具有更好的稳定性,并且发现在高TC超导中增强助焊剂的磁化率有效系统。在本文中,已经进行了研究,以研究并审查非超导微米尺寸agparticle对Re-Ba-Cu-O(Re = SM,Gd&Y)123高-TC陶瓷型电导系统的基质的影响。进行XRD,SEM,磁化,磁传输和微波诱导DC电压测量,以研究AG进入123超导系统的影响。观察到将AG的控制加入SM-BA-CU-O(SBCO),GD-BA -Cu-O(GBCO)和Y-Ba-Cu-O(YBCO)陶瓷超导体不会与金属形式中的分解阶段对反应反应。这带来了正常状态电阻率的降低。磁性临界电流密度(JMC),传输临界电流密度(JTC)的探测力,因此用AG添加到3个系统中的固定力密度(F_P)建议在晶间区域和更强的Josephson中创建SNS型接近交界处电流路径有超导嵌段。这归因于通过Ag添加到上述超导系统中的Ag加入的物理致密化和弱链路总数。

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