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ARE SELECTIVE SOLDERING FLUXES RELIABLE?

机译:选择性焊接助焊剂可靠吗?

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Miniaturization results in an increased number of smaller SMD components on a printed circuit board (PCB). The distance between components is reduced (fine-pitch technology) and the number of through-hole components decreases. This includes more reflow applications and affects the assembly method for the remaining small number of pin connectors. Selective soldering methods become more popular and wave solder equipment is replaced by advanced selective soldering machines. Solder materials are dealing with other trends. First there is a cost issue that makes engineers look into cheaper materials and second there is an environmental/green technology trend. Translated into solder flux technology, this results in further interest for water-based VOC-free fluxes. Water is less expensive than alcohol and transportation costs are lower. No alcohol exhaust is another step to a more environmental friendly industry.
机译:小型化导致印刷电路板(PCB)上的较小SMD部件数量增加。组件之间的距离减小(细距技术),并且通孔部件的数量降低。这包括更多的回流应用,并影响剩余少量引脚连接器的装配方法。选择性焊接方法变得更加流行,波焊设备被先进的选择性焊接机取代。焊料材料正在处理其他趋势。首先,有一个成本问题,使工程师看起来更便宜,而第二种环境/绿色技术趋势。翻译成焊料助焊剂技术,这导致水基VOC的助循环进一步感兴趣。水比酒精便宜,运输成本较低。没有酒精排气是更环保的行业的另一步。

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