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Electrochemical Surface Preparation of Passive Metallic Substrates for Electroplating

机译:电镀电镀无源金属基板的电化学表面制备

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The overall objective of this work is to electrolytically prepare metallic substrates of passive materials for subsequent electrodeposition. The challenge in plating on passive materials such as titanium, stainless steel and nickel-based alloys, is the tenacious oxide film that readily forms on the surface almost instantaneously when exposed to the atmosphere. This is overcome in current practice, through aggressive precleaning steps that often include toxic electrolytes such as nitric, sulfuric and hydrofluoric acids. An alternative surface preparation technique to mitigate the need for aggressive chemicals is presented in this work. The focus of this engineering study was to develop the preliminary understanding required to successfully remove the surface oxide and plate on passive substrates, from an electrolytic benign process.
机译:本作作品的总体目的是在后续电沉积的情况下电解制备无源材料的金属基板。电镀诸如钛,不锈钢和镍基合金之类的被动材料的挑战是在暴露于大气中几乎瞬间在表面上易于形成的粗加工氧化膜。通过侵略性的预精细步骤克服了当前实践,通常包括毒性电解质,例如硝酸,硫酸和氢氟酸。在这项工作中介绍了减轻对侵蚀性化学品的需要的替代表面制备技术。该工程研究的重点是从电解良态过程开发成功除去无源基板上的表面氧化物和板所需的初步理解。

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