Experimental analysis of propagation of the delamination in Flex-PCBs subjected to thermal cycling loading

摘要

In this work it will be discussed a non-destructive method based on scanning acoustic microscopy (SAM) investigation to identify the delamination failure. The samples were subject to shock test analysis (TST) and in each thermal cycle, the sample was checked for physical medium delamination failure. The SAM detection analysis will be presented in a complete propagation excursion considering 1500 thermal loading cycle. And also some analysis about the mechanical structure of the Flex-PCBs samples that contributed to the delamination.