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Study of Damage Mechanism of High Power Microwave on Electronic Equipments

机译:高功率微波对电子设备的损伤机理研究

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Currently, damage effect of high power microwave (HPM) on electronic equipments is of increasing interest. HPM can disturb, damage, or destroy many military or civil electronic equipments. In this paper, the representative HPM waveform is investigated in time and frequency field respectively, and the main characteristics (peak power, rise time, power density, etc) are analyzed and listed. HPM generation devices and radiation are also discussed. Coupling energy into electronic devices via front door and back door, as a function of coupling coefficient and the effective area, is modeled. By presenting lots of kinds of coupling modes and paths, damage effects are divided into five different classes, and damage mechanism of HPM on electronic equipments is proven in the paper.
机译:目前,高功率微波(HPM)对电子设备的损伤效果越来越令人利益。 HPM可以打扰,损坏或摧毁许多军事或土气设备。在本文中,分别在时间和频率场中研究了代表性HPM波形,并分析了主特性(峰值电源,上升时间,功率密度等)。还讨论了HPM生成装置和辐射。模型通过前门和后门将能量耦合到电子设备中,作为耦合系数和有效面积的函数。通过呈现许多种类的耦合模式和路径,损伤效果分为五种不同的类别,并在纸上证明了HPM对电子设备的损坏机制。

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