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Diclofenac Sodium Loaded Multicomponent Implant

机译:双氯芬太米钠负载多组分植入物

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Earlier we have reported on developing DS releasing bioabsorbable rods for inhibition of osteolysis [l]. Due to their unsatisfactory drug release profiles we assessed the use of sintering technique of enhancement of drug release in the current study. Melt extruded PLGA 80/20 rods were compounded 8 wt-% DS. Some rods were self reinforced (SR) and some of them were sterilized to get three different components with different drug release profiles. Different rods were sintered together with heat and pressure. Three different specimen groups with different construction were studied. Thermal properties were analyzed using differential scanning calorimetry (DSC). Changes of IV were performed with capillary analysis and drug release measurements with UV-Vis spectrophotometer. Mechanical strength were measured two weeks, when disintegration occurred. Release rate consisted of 1) sharp jump start peak, 2) second smoother peak, and 3) third smooth peak. Released DS concentrations reached local therapeutic levels and maintained at that stage for 24–36 days. All DS was released during 50–70 days. The drug release from multicomponent implant was more stable and commenced earlier than from initial rods. Such properties were favored ones. Initial shear strength was 82 MPa and it decreased to 15 MPa. The mechanical bonding was sufficient although the components disintegrated relatively fast. By sintering different PLGA/DS components with different release rates it is possible to construct a truly controlled release implant for bone fixation with anti-inflammatory properties.
机译:早些时候我们报道了开发DS释放的生物可吸收棒用于抑制骨解[L]。由于其不令人满意的药物释放型材,我们评估了目前研究中药物释放的增强烧结技术的使用。熔融挤出的PLGA 80/20棒复合8重量%的DS。有些棒是自我加强(SR),其中一些棒被灭菌以获得具有不同药物释放型材的三种不同的组分。将不同的棒与热压烧结在一起。研究了具有不同结构的三个不同的样本组。使用差示扫描量热法(DSC)分析热性能。用UV-Vis分光光度计进行毛细管分析和药物释放测量进行IV的变化。在发生崩解时,测量机械强度两周​​。释放率包括1)尖锐的跳跃峰值,2)第二更平滑的峰值,3)第三个光滑峰。释放的DS浓度达到局部治疗水平,并在该阶段保持24-36天。所有DS都在50-70天内发布。来自多组分植入物的药物释放比初始杆更稳定并开始。这些性质是有利的。初始剪切强度为82M​​Pa,降至15MPa。虽然组分相对快速崩解,但机械键合足够。通过烧结具有不同释放速率的不同PLGA / DS组分,可以构建真正控制的释放植入物,用于具有抗炎性质的骨固定。

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