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A Robust Process for the Fabrication of Field Emission Backlights

机译:用于制造场发射背光的鲁棒过程

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摘要

In this paper, we present a novel process for the realization of large area, low cost field emission cathodes. The process makes use of alumina substrates, which are anodically oxidized in order to yield porous structures capable of hosting metal catalyst nanoparticles. By carefully controlling the final stage of the anodisation as well as the electrodeposition conditions, it is possible to fine tune the density of such catalysts in the range of 10~8-10~9cm~2. The catalytic growth of CNTs is subsequently performed at low temperature (~ 600°C or below, thanks to the use of H_2O), using plasma enhanced chemical vapour deposition. There is no lithography need to make the cathode and current densities of ~ 1mA/cm~2 are easily obtained.
机译:在本文中,我们提出了一种实现大面积,低成本场发射阴极的新方法。该方法利用氧化铝底物,其阳极氧化以产生能够托管金属催化剂纳米颗粒的多孔结构。通过小心地控制阳离子的最终阶段以及电沉积条件,可以微调这种催化剂的密度在10〜8-10〜9cm〜2的范围内。随后使用等离子体增强的化学气相沉积,随后在低温(〜600℃或以下)下进行CNT的催化生长。没有光刻需要使阴极和电流密度易于获得〜1mA / cm〜2。

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