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Electrical Transport and Impedance Analysis of Au/Porous Silicon Thin Films

机译:Au /多孔硅薄膜的电气输运和阻抗分析

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In order to obtain electronic devices based on PS/p-Si structure, we present a study the AC conductivity and Thermo-electrical behavior of Porous Silicon (PS) layers prepared by electrochemical etching in p-type silicon (p-Si) <100> substrates. The beginning is obtaining good electrical contacts on porous layer; for this reason, several Au/PS/Au junctions were electrically characterized to understand the transport mechanisms in porous surface and the temperature dependence in the porous properties studied, also the resistance-temperature characteristic of PS/p-Si thermistor device. Finally, we obtained the AC conductivity in modulo and phase; an electrical equivalent circuit was proposed to fit the experimental frequency response of the different samples.
机译:为了获得基于PS / P-Si结构的电子器件,我们介绍了通过P型硅(P-Si)<100中通过电化学蚀刻制备的多孔硅(PS)层的AC电导率和热电特性的研究>基材。开始是在多孔层上获得良好的电接触;因此,电特征在于几个Au / ps / au结,以了解多孔表面中的传输机制以及所研究的多孔性能的温度依赖性,也是PS / P-Si热敏电阻装置的电阻温度特性。最后,我们在模动和阶段获得了交流电导率;提出了一种电力等效电路以适合不同样品的实验频率响应。

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