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High Resolution and Contrast X-Ray for 3D Package Development - (PPT)

机译：用于3D封装开发的高分辨率和对比X射线 - （PPT）

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Through silicon vias are successfully studied using x-ray tomography technique. High-resolution images allow observation of voids in the vias in detail. Large field of views enables investigation of vias in high-throughput. Tomographic imaging and virtual slices show the shape of the void in 3D.

机译：通过硅通孔通过X射线断层扫描技术成功研究。高分辨率图像允许详细观察VIOS中的空隙。大领域的视野使得能够在高吞吐量中调查vAI。断层摄影成像和虚拟切片显示了3D中的空隙的形状。

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《SMTA 3D/SiP Advanced Packaging Symposium 》|2008年||共53页
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Bill Baker;
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中图分类 TN405-53;
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High Resolution and Contrast X-Ray for 3D Package Development - (PPT)

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