Qualification Challenges on SiP/3D Advanced Packages - From an User's Perspective-(PPT)

摘要

3D or SiP packages are getting more attention due to the demands for high density in volume-sensitive applications and demands on performance in high- end applications. Device designs need tight relationships with users/systems. Assembly partners need to provide a robust package compatible with complicated manufacturing processes via use of unique materials. How the 3D/SiP packages are used in a system/product (w/adequate reliability) becomes critical.