NANOSOLDER - WHAT NEXT?

摘要

Initial studies by the iNEMI Nanosolder Working Group showed the feasibility of using nano-solder particles as a way to reduce the lead-free solder reflow temperature. This work is continuing and has been enhanced by a project financed by the National Science Foundation at Purdue and Metamateria Partners, exploring the mechanism of nano solder consolidation. This paper reviews the data and suggests the next steps towards developing a commercial family of products.