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Failure Mechanisms of SAC 305 405 in Harsh Environments and Influence of Board Defects including Black Pad-(PPT)

机译:SAC 305&405在恶劣环境中的失败机制以及包括黑色垫(PPT)的板缺陷的影响

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-55°C to 125°C reliability testing. PBGA196, PBGA256, PBGA676, CSP64, and LGA64. Pure SAC 305 and SAC 405 assembled components. Weibull or event plots. Compared to the 0°C to 100°C cycle testing. The difference in SAC 405 and SAC 305 microstructure that may explain the different behavior under thermal cycling. As-assembled. Forming during thermal cycling. Brittle interfacial fracture in LGA64 and CSP64 on ENIG under harsh environment cycling.
机译:-55°C至125°C可靠性测试。 PBGA196,PBGA256,PBGA676,CSP64和LGA64。纯SAC 305和SAC 405组装部件。威布尔或事件情节。与0°C相比至100°C循环测试。囊405和囊305微观结构的差异可以解释热循环下的不同行为。组装。在热循环期间形成。恶劣环境循环下LGA64和CSP64脆性界面骨折。

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