Thermal cycling for Lead-free Solder Dwells and Ramps-(PPT)

摘要

The experimental design includes a new sample geometry that permits small solder volumes to be studied. Solder properties can be collected for lead-free solder alloys under conditions that reflect common usage (in shear). Stress relaxation at various dwell times and temperatures can be assessed. Stress relaxation at various ramp rates and temperatures can be assessed.