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Mechanisms of Formation of Submicron Grain Structures by Severe Deformation

机译:严重变形形成亚微米晶粒结构的机制

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The grain refinement mechanisms operating during severe deformation processes, like ECAE, are discussed using data obtained from model Al-alloys. Refinement occurs predominantly by orientation splitting, micro and macroshear banding, and the geometric requirement for high angle boundary area to increase with strain. The deformation structure evolution is affected strongly by the processing route, die geometry, and material parameters. Both cell bands and microshear bands show strong alignment with the dies shear plane. Shear bands are promoted by changes in the shear plane orientation each extrusion cycle. At high strains a steady state is approached, where the grain size converges with the subgrain size, controlled by dynamic boundary migration.
机译:使用从模型Al合金获得的数据讨论在严重变形过程中操作的晶粒细化机制如ECAE。通过定向分裂,微观和宏辐射和高角度边界区域的几何要求主要发生改进,与应变增加。通过加工路线,模具几何和材料参数强烈地影响变形结构演化。两个单元带和微汗带都显示出与模具剪切平面的强对准。通过剪切平面取向的变化来促进剪切带的每个挤出循环。在高菌株处,接近稳态,其中晶粒尺寸与子粒尺寸收敛,由动态边界迁移控制。

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