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LINEAR SUPERPOSITION AND THE TRUE MEANING OF THETA-JA

机译:线性叠加和Theta-JA的真正含义

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The single most common thermal question asked of semiconductor component suppliers is "What is Theta-JA for this device?" The only completely truthful answer, however unsatisfying, is always "It depends." This presentation will tackle the issue using the physical/mathematical concept of linear superposition. We will see not only why the simplistic question regarding Theta-JA is virtually always meaningless, but point to better questions to be asked in its place, and in particular, provide a methodology for answering the possibly most significant question of all, namely "How do other heat sources in this system affect the thermal performance of the device I thought I cared about?" Linear superposition says, in short, that you can make predictions about the operating temperature of devices of interest within your system, by considering each heat source in the system individually, and then summing up the responses. Thus, once we have our arms around the concept of linear superposition, we will also find that some other important questions have comprehensible answers, for instance, "What are my real design margins for avoiding thermal runaway?" and "Why do I get worse thermal performance when I put 10 packages, 1/10th the size of the previous generation, into the same space?"
机译:询问半导体组件供应商的单一最常见的热问题是“此设备的θ-ja是什么?”唯一完全诚实的答案,无论是不满意的,总是“这取决于”。此演示文稿将使用线性叠加的物理/数学概念来解决问题。我们将不仅会看到为什么有关Theta-Ja的简单问题几乎总是毫无意义,但指出了在其位置询问的更好问题,特别是提供一种方法来回答所有最重要的问题,即“如何在该系统中的其他热源是否会影响我认为我所关心的设备的热性能?“简而言之,线性叠加表明,您可以通过在单独考虑系统中的每个热源,然后求解响应,使您的系统内容的感兴趣设备的操作温度进行预测。因此,一旦我们围绕线性叠加的概念,我们也会发现一些其他重要问题具有可理解的答案,例如“我的真实设计边距是什么,以避免热失控?”和“当我把10个包装,前一代的大小放入同一空间时,为什么我为什么会变得更糟糕的热性能?”

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