Practical Comparison of Heat Pipes and Vapor Chambers in Various Heat Spreading Applications to Show Total Cost vs. Benefit - (PPT)

摘要

Solid metal base cannot cool next-gen/high power chips. Many options increase heat spreading & overall cooling Consider not just thermals but total cost on each program. Examine each spreading alternative for: Part and Tooling Cost; - Reliability/Qualification; - Time to Market; - Effective Heat Sinks must work both Thermally and Economically. - V. Chambers are NOT the one solution for every application.