Market demands for increasing performance for electronics thermal and packaging materials. Driven by continual miniaturization, functionality improvement, and reliability improvement. Materials must work together across all levels of packaging. Improvements are required for: Alternatives to lead-free solders for high temperature and extreme conditions; Alternative metal joining processes and materials; Implementation of monolithic alloys across module to reduce CTE mismatch stresses; Stable TIMs and joining materials, reliable over time to product end-of-life, especially in high temperature operating range; Baseplate and heat spreader materials having improved CTE matching to GaN, SiC materials and higher thermal conductivity.
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