THERMAL CYCLING STABILITY OF HIGH THERMAL CONDUCTIVE DIAMOND METAL MATRIX COMPOSITES - (PPT)

摘要

1. Interface between matrix and filler is crucial for exploitation of the thermal properties. Formation has to be finished and thermally stable. 2. Thermal conductivities of 600 W/mK (@RT) can be obtained. Depending on the application, reduction of several percent has to be taken into account when thermal cycling. 3. Tailoring the coefficient of thermal expansion is possible. Thermal treatment does only marginally change its value. 4. First parts have been prepared showing the potential of these manufacturing processes for the preparation of more complex shaped components. 5. Rapid hot pressing seems to be a promising cost efficient manufacturing method for Al-/Cu-based composites.