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DEVELOPMENT OF ACCELERATED ENVIRONMENTAL EXPOSURE TESTS THAT TARGET SPECIFIC DEGRADATION MECHANISMS

机译:靶向特定降解机制的加速环境暴露试验的发展

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Given the wide variety of industrial environments that control electronics are exposed to, prevention of all environmental degradation mechanisms during use can be a challenge. Mixed Flowing Gas (MFG) environments have been used for years to understand how a specific electronic component or assembly may perform in harsh industrial environments. The problem is that standardized MFG tests do not accelerate certain corrosion mechanisms found in specific application environments, especially some diffusion rate-controlled mechanisms. Also, in many accelerated tests, the surface corrosion rates on silver and copper coupons may not reflect the corrosion rates of other mechanisms that can occur on the various components and surfaces of a printed circuit board assembly. Rockwell Automation has undergone a long-term study on how to accelerate specific problematic corrosion mechanisms that can occur in various customers' industries. The first stage of the investigation was centered on varying standard gas concentration, temperature, and relative humidity of a typical MFG test to drive specific degradation mechanisms. This testing did not yield the intended results. It was apparent that the chemical structure and synergistic effects of the specific contaminants in these application environments were driving the degradation. Thus, air testing was performed at multiple application sites to identify the contaminants in the environments. Once contaminants were identified, testing was performed to determine which components of the contaminates played a role in the degradation. Testing was then done to identify synergistic effects between contaminants and determine the possible chemical reactions between functional groups. Once active chemical participants were identified, the logistics of how to deliver controlled gas phase concentrations of the contaminants were developed and tested. This article details the processes used to develop several unique accelerated exposure tests.
机译:鉴于控制电子产品暴露的各种工业环境,在使用期间预防所有环境退化机制可能是一个挑战。多年来已经使用了混合流动气体(MFG)环境以了解特定的电子元件或组装在恶劣的工业环境中的表现。问题是标准化的MFG测试不会加速特定应用环境中发现的某些腐蚀机制,特别是一些扩散速率控制机制。而且,在许多加速测试中,银和铜试样上的表面腐蚀速率可能不反映在印刷电路板组件的各种部件和表面上可以发生的其他机构的腐蚀速率。罗克韦尔自动化经历了关于如何加速在各种客户行业中可能发生的特定问题腐蚀机制的长期研究。调查的第一阶段以不同的标准气体浓度,温度和典型的MFG试验的相对湿度为中心,以驱动特定的降解机制。该测试没有产生预期的结果。显然,这些应用环境中特定污染物的化学结构和协同效应正在推动降解。因此,在多个应用部位进行空气测试,以识别环境中的污染物。一旦鉴定污染物,就进行测试以确定污染物的哪些组分在降解中发挥作用。然后进行测试以鉴定污染物之间的协同效应,并确定官能团之间的可能的化学反应。一旦确定了活性化学参与者,开发并测试了如何递送如何递送控制气相浓度的污染物的物流。本文详细介绍了用于开发几种独特加速曝光测试的过程。

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