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Application of Finite Elements on Non-Linear Deformation of Flexographic Photopolymer Printing Plate

机译:有限元在柔性荧光聚合物印刷版非线性变形上的应用

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Printing offers the possibility of producing mass quantities of a wide variety of electronic components and devices quickly and at lower cost. Flexography is mainly used for packaging applications, but is also a potential method for the micro manufacture of electronic devices, smart packaging and RFID. Fine solid lines of high quality are essential to enable printing of ink tracks for electronic applications. Plate characteristics are among a number of process parameters that will influence print line quality, which will affect the electrical performance of printed tracks. Deformation of the photopolymer plate is an important factor in determining the line quality. Therefore, an investigation into plate deformation is vital. A numerical model of close multiple lines has been developed and used to examine its deformation under a range of printing conditions. An Ogden constitutive model was used to describe the response of the photopolymer plate material. A series of uniaxial tension and pure shear experiments was carried out to provide mechanical properties of the photopolymer. In validation of the material model, numerical results agree well with the experimental data in both simple tension and pure shear. Numerical models were then used to determine the change in line profile, as the deformations occur on a microscopic level and cannot be assessed experimentally. The simulations yield information on line width increase due to plate deformation. However, the predicted line width is smaller than that of printed line measured using image analysis. The difference in line width is due to ink spreading and by relating the numerical results with those from the printed copy; the proportion of increase in line width due to the deformation of the printing plate has been quantified at 53 to 69%.
机译:印刷提供了快速且以较低的成本生产各种电子元件和设备的质量批量的可能性。 Flexograph主要用于包装应用,但也是电子设备,智能包装和RFID的微观制造的潜在方法。精细的高质量线对于实现电子应用的墨迹印刷至关重要。板特性是影响印刷线质量的多个工艺参数中,这会影响印刷轨道的电气性能。光聚合物板的变形是确定线路质量的重要因素。因此,对板变形的调查至关重要。已经开发了一种关闭多条线的数值模型,并用于在一系列印刷条件下检查其变形。奥甘本构模型用于描述光聚合物板材的响应。进行一系列单轴张力和纯剪切实验以提供光聚合物的机械性能。在材料模型的验证中,数值结果与简单张力和纯剪切的实验数据很好。然后使用数值模型来确定线轮廓的变化,因为在微观水平上发生变形并且无法通过实验评估。由于板变形,模拟产生有关线宽增加的信息。然而,预测的线宽小于使用图像分析测量的印刷线的线宽。线宽的差异是由于墨水扩散,并且通过与来自印刷拷贝的数字结果相关的数值结果;由于印版的变形引起的线宽增加的比例已经在53至69%上量化。

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