首页> 外文会议>International Conference on The Mechanical Behavior of Materials >Modelling Intergranular Stress Corrosion Cracking in Simulated Three-dimensional Microstructures
【24h】

Modelling Intergranular Stress Corrosion Cracking in Simulated Three-dimensional Microstructures

机译:模拟三维微观结构中的晶间应力腐蚀裂纹

获取原文

摘要

Microstructure can have a significant effect on the resistance to intergranular stress corrosion cracking. Certain grain boundaries are susceptible to corrosion while others have high resistance and may form crack bridging ligaments as the crack deviates around them. To investigate the mechanics of crack bridging, 3D computational model has been previously developed. An extension to the model, to include stress corrosion crack growth kinetics is presented in this paper. An analysis of the effects of resistant grain boundary fraction demonstrates that the bridging ligaments can significantly retard short crack propagation rates. Increasing the fraction of resistant boundaries is shown to improve microstructure resistance by reducing the crack propagation rate.
机译:微观结构可对抗晶间应力腐蚀裂缝具有显着影响。某些晶界易受腐蚀的影响,而其他晶界具有高抗性,并且可以在裂纹周围偏离它们时形成裂缝桥接韧带。为了研究裂缝桥接的机制,先前已经开发了3D计算模型。本文介绍了模型的延伸,包括应力腐蚀裂纹生长动力学。抗性晶界分数的影响分析表明桥接韧带可以显着延缓短裂纹传播速率。随着降低裂纹传播速率,显示增加抗抗边界的级分。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号