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Validation of Alternative RoHS Compliant Au-pastes for the DuPont LTCC 951 System

机译:验证符合DuPont LTCC 951系统的替代RoHS符合AU粘贴

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The restriction of the use of certain hazardous substances (RoHS) came into force on 1st July 2006. Equipment producers will need to obtain materials declarations or certificates of compliance from their suppliers. Certain exemptions from this regulation, e.g. RF-ports and certain medical applications, still allow to manufacture LTCC products with non RoHS compliant materials. However, there is a continuously growing demand for LTCC products without cadmium or lead. Since end of 2006 DuPont is offering Cd-free Au-pastes as possible replacements for established products. For cofiring internal and external conductors Au-paste type 5734 is frequently used by LTCC manufacturers. The alternative RoHS compliant paste is type CDF34. For pin, tab, and frame brazing a combination of Au-pastes 5062D (adhesion layer) and 5063D (barrier layer) are currently the first choice for according LTCC parts at MSE. The Cdfree versions are types 5062E and 5063E. MSE is currently validating all 3 new pastes according to a comprehensive test plan which includes 5 different test layouts for CDF34 and another 2 for 5062E, 5063E. Simultaneously, corresponding reference parts were started to have exact comparison possibilities. The validation of CDF34 includes the investigation of bondability, reliability of resistor terminations, vias, and adhesive bonded components. Furthermore, the lateral migration (insulation resistance) will be tested. The 5062E, 5063E validation includes reliability of soldered components, vias in soldered pads and soldering of frames and base plates. The different test cells include visual inspection and x-sections, initial measurements and results after thermal cycling, thermal storage, thermal shock, and humidity exposure.
机译:使用某些有害物质指令(RoHS)的限制生效于2006年7月1日设备制造商需要从供应商处获得的材料声明或纸等。从这种调节,例如某些例外RF端口和某些医疗应用中,仍然允许制造LTCC产品不符合RoHS标准的材料。然而,有一个不断增长的LTCC产品的需求没有镉或铅。自2006年底杜邦公司提供无镉金糊浆作为成熟产品可能的替代品。对于共焙烧的内部和外部导体的Au-糊型5734是经常使用由LTCC厂家。另一种选择符合RoHS膏型CDF34。为销,选项卡,和帧钎焊的组合的Au-粘贴5062D(粘合层)和5063D(阻隔层)是目前用于根据在MSE LTCC部件的第一选择。该Cdfree版本类型5062E和5063E。 MSE当前验证所有3个新的糊根据一个全面的测试计划,其中包括用于CDF34和5个不同的测试布局另一个2 5062E,5063E。同时,相应的参考部分中开始有精确比较的可能性。 CDF34的验证包括接合性的调查,电阻器端子,通孔的可靠性,和粘合剂粘合的部件。此外,横向迁移(绝缘电阻)将被测试。的5062E,5063E确认包括焊接部件,焊接在焊盘和框架和基板的焊接通孔的可靠性。不同的测试细胞包括视觉检查和X段,初始测量和热循环后的结果,储热,热冲击,和高湿暴露。

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