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Pulsed-DC Electrophoretic deposition (EPD) of aqueous alumina suspension for controlling bubble incorporation and deposit microstructure

机译:含水氧化铝水溶液悬浮液(EPD)控制气泡掺入和沉积微观结构的脉冲DC电泳沉积(EPD)

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Electrophoretic deposition (EPD) from aqueous suspension generally forms deposit containing incorporated bubbles because of evolution of gases at electrodes due to electrolysis of water. We have demonstrated here that application of pulsed voltage /current instead of continuous DC enables controlling the amount of bubble incorporation and obtain bubble-free deposits during EPD of aqueous suspension. The yield and bubble incorporation decreased progressively with decrease in size of the applied pulse. A characteristic band of deposition window was found in the plot of voltage/current vs. pulse width within which smooth and bubble-free deposits are obtained. The window is wider at low applied voltages/currents than at higher voltages/currents implying that it is more easier to control the pulsed EPD at lower applied voltages and/currents. No deposition occurred below the window whereas deposits with incorporated bubbles formed above the window. Suppression of bubbles with decreasing pulse size was attributed to decrease in the amount of hydrogen evolved per pulse and verified by monitoring the gain in weight of palladium (Pd) electrode used as cathode during electrolysis of water.
机译:来自含水悬浮液的电泳沉积(EPD)通常是由于电解在水的电解中的气体的演变而形成含有掺入气泡的沉积物。我们在此证明,脉冲电压/电流的应用而不是连续DC的应用能够控制泡沫掺入的量并在水性悬浮液的环己烷中获得无囊沉积物。产率和气泡掺入随着施加脉冲的尺寸的降低而降低。在电压/电流与电流Vs的曲线图中发现了沉积窗口的特征频带。获得光滑的和无气泡沉积物。窗口在低施加的电压/电流下更宽,而不是在较高的电压/电流中,这暗示在较低施加的电压和/电流下控制脉冲EPD更容易。在窗口下方没有发生沉积,而在窗口上方形成的沉积物的沉积物。抑制脉冲尺寸降低的气泡归因于每次脉冲的氢量降低,并通过监测在水的电解期间用作阴极的钯(Pd)电极的重量增益来验证。

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