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Method of Electrophoretic Depositing (EPD) a Film on a System and System Thereof
Method of Electrophoretic Depositing (EPD) a Film on a System and System Thereof
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机译:在系统上电泳沉积(EPD)薄膜的方法及其系统
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摘要
A packaged component and a method for making a packaged component are disclosed. In an embodiment the packaged component includes a component carrier having a component carrier contact and a component disposed on the component carrier, the component having a component contact. The packaged component further includes a conductive connection element connecting the component carrier contact with the component contact, an insulating film disposed directly at least on one of a top surface of the component or the conductive connection element, and an encapsulant encapsulating the component carrier, the component and the enclosed conductive connection elements.
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