Atomic Layer Deposited Films for Micro- and Nano-scale Electro-Mechanical Systems

摘要

Atomic Layer DePosition (ALD) can be effectively used to deposit custom-designed, multi-material layers with atomic resolution on any micro- or nano-scale device surface. The nano-scale ALD coating can protect the devices from electrical short, charge accumulation, moisture-induced adhesion, wear, corrosion, creep, fatigue and anodic oxidation during short-term protoyping or long-term product life. Alternatively, ALD films can be lithographically defined in selected areas and micromachined to create ultra-thin nanoscale structures.