An ultrafast Geiger-mode single-photon avalanche diode in 0.18-μm CMOS technology

摘要

We demonstrate a new single-photon avalanche diode (SPAD) device, which utilizes the silicon-dioxide shallow-trench isolation (STI) structure common to all deep-submicron CMOS technologies, both for junction planarization and as an area-efficient guard-ring. This makes it possible to achieve an order-of-magnitude improvement in fill factor and a significant reduction in pixel area compared with existing CMOS SPADs, and results in improved SPAD performance. We present numerical simulations as well preliminary experimental results from a test chip, which was manufactured in an IBM 0.18 μm CMOS technology, and which incorporates the devices. With these new and efficient structures, 12 μm-pitch pixels with sub-10ns dead times are achievable without requiring active recharge, creating the opportunity to integrate large arrays of these ultra-fast SPADs for use in biological imaging systems.