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Design, Analysis, and Characterization of Tri-Modal 12.8 Gbps Single-Ended and 20 Gbps Differential Memory Interfaces

机译:Tri-Modal 12.8 Gbps单端和20 Gbps差分内存接口的设计,分析和表征

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In this paper, we present the design, analysis, and characterization of tri-modal parallel interfaces using single-ended and differential signaling offering data rates of 12.8 Gbps and 20 Gbps, respectively. These bidirectional memory interfaces also communicate with standard DDR3 and GDDR5 DRAMs at 1.6 Gbps and 6.4 Gbps, respectively with no package change. The interface is enabled by substantially sharing and reuse of the circuit elements between the signaling modes, particularly at the driver output stage and the clocking circuits. The two designs also incorporate stress protection mechanism that guards thin-oxide devices used in the high-speed mode against the high IO voltage of DDR3 and GDDR5 standards. The system uses asymmetrical architecture where the equalization and timing adjustment circuits for both memory WRITE and READ transactions are on the controller to reduce the memory cost. The analysis and optimization steps employed to mitigate the effect of inter-symbol interference, crosstalk, and supply noise are discussed. The effect of data encoding techniques on system timing margin is also investigated at a small incremental cost impact to the system. We further compare measured silicon data from the single-ended and differential interfaces. Several of the noise reduction techniques, such as coding and noise tracking, were also verified with measurement made on a prototype system. The interface consisting of 16 data links achieves efficiency of better than 5.0 m W/Gbps and 6.1 m W/Gbps for 12.8 Gbps single-ended and 20 Gbps for differential signaling, respectively.
机译:在本文中,我们使用单端和差分信号分别提供12.8 Gbps和20 Gbps的数据速率的三模模式并行接口的设计,分析和表征。这些双向存储器接口还分别与1.6 Gbps和6.4 Gbps的标准DDR3和GDDR5 DRAM通信,没有包装。通过基本上共享和重复使用信令模式之间的电路元件,特别是在驾驶员输出级和时钟电路上来实现接口。这两种设计还包括应力保护机构,该压力保护机构防范高速模式中使用的氧化氧化物装置,抵御DDR3和GDDR5标准的高IO电压。系统使用非对称架构,其中存储器写入和读取事务的均衡和定时调整电路位于控制器上以降低存储器成本。用于减轻符号间干扰,串扰和供应噪声的影响的分析和优化步骤。还在对系统的小增量成本影响下研究了数据编码技术对系统时序边缘的影响。我们进一步将测量的硅数据从单端和差分接口进行了比较。还通过对原型系统进行的测量来验证了几种降噪技术,例如编码和噪声跟踪。由16个数据链路组成的界面分别实现了12.8 Gbps单端和20 Gbps的5.0 m w / gbps和6.1 m w / gbps的效率,分别用于差分信令。

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