Investigation of electroless tin deposition from acidic thiourea-type bath

摘要

The constant tendency of miniaturization in electronic products and developments in surface assembly techniques creates requirement to prepare new techniques and processes also in the range of metallic coatings. An additional factor which influences the evolution of preservatives coatings technology is the necessity to adapt Polish law to European directive. From 1st July 2006 there will be an obligatory RoHS directive banning applying lead in electronics. Electroless tin deposition is one of an alternative for Sn/Pb lead free preservative films on copper surface in PCB technology.