Single Package Re-Configurable Processor for Data Acquisition at 250°C

摘要

A high-temperature data processing device is required for applications gathering sensor data and control of electronics in environments which operate above 200°C. This paper discusses the process of leveraging advances in high temperature electronics and integrating them for new applications and improved system performance. It centers on the development of the 250°C High Temperature (HT) SOI CMOS process technology, several new HT products, and HT package technology. Honeywell integrates a HT FPGA, SRAM and EEPROM into a Multi-Chip Module (MCM) creating a flexible, re-configurable computing platform for sensor data processing and control applications at 250°C. A reconfigurable processor enables the ability to gather information from multiple sources and then control multiple devices with a single electronics assembly while reducing size, weight and power. Packaged in a small 2.2×0.75 inch (56×18 mm) MCM, the module operates at clock rates up to 10MHz from a single 5V supply. Although power consumption is strongly dependent on configuration, the targeted demonstration configuration clocked at 1MHz power dissipation is on the order of 100mW. The combination of all these technologies and application code to operate the module provides a significant improvement over existing technology for data acquisition applications.