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Epitaxial growth of highly strained Si on relaxed Ge/Si(100) using ECR plasma CVD without substrate heating

机译:使用ECR等离子体CVD在没有基底加热的ECR等离子CVD上的高度紧张SI的外延生长

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In this work, using a Ge film as a buffer layer, highly strained Si epitaxial growth on Ge/Si(100) has been investigated. Epitaxial growth of strained Si films on 84 %-relaxed Ge/Si(100) is achieved using ECR plasma CVD without substrate heating. Especially for the thickness of 1.7 nm, strain amount in the strained Si reaches as high as 4 % and it is thermally stable even at 500/spl deg/C.
机译:在这项工作中,使用GE膜作为缓冲层,研究了GE / Si(100)上的高度紧张的Si外延生长。使用没有基底加热的ECR等离子体CVD实现84%-LELAXEDGE / Si(100)上的应变Si膜的外延生长。特别是对于厚度为1.7nm,应变量在应变量高达4%,即使在500 / spl deg / c时也是热稳定的。

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