For cross-sectional EBSD(electron backscatter diffraction) analysis, FIB(focused ion beam) milling and coating of conducting materials(carbon or gold) are developed to smooth the rough cutting surface and decrease the charging effect caused by IMD(inter-metallic dielectric) deposits. The copper electrodeposits in trench plug are figured as a single crystal having a few of twinnings. Interestingly, the crystallographic orientation of the overplating region is also founded to be same as that of trench plug. Additionally this experiment shows that the texture of overpiating region also as the {lll}<110> texture, as same as the texture in trench plug. Namely the recrystallization, which has initiated at the specific point in trench plug, can be propagated into the overplating region. Converse^, the movement of grain growth in a trench plug during self-annealing can be inferred by measuring that in the overplating region. Therefore, the in-situ planar EBSD analysis for a self-annealed specimen shows that the grain growth is initiated at the pattern area and the grain usually grows isotropically.
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