Via is commonly seen in multilayer PCB as part of the interconnect. With the data rate increasing to 56G or even higher, accurate modeling of differential vias becomes critical for high-speed designs. It is challenging to characterize the differential vias from modeling, simulation and measurement. Achieving a good correlation up to 50GHz or higher frequencies is even more challenging. The paper presents a complete flow covering modeling, simulation, measurement with de-skew, de-embedding, and their correlation. A novel magnetic current coupled multi-layer MoM is proposed, which shows significant speedup while maintaining the same accuracy as conventional 3D FEM solvers. Both 3D modeling data and de-embedded measurement data are correlated with each other demonstrating the effectiveness of the proposed methodology for extracting the differential via pair. Newly revealed differential via nature calls for optimization with the connecting traces, which achieves the purposes of the paper.
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