New Toroidal Inductor Configurations for LTCC Applications

摘要

This paper introduces a new inductor topology based on a toroidal design in a multi-layered configuration, suitable for LTCC and on-chip applications. Multiple-coupled line structures on multi-level substrate configuration comprise the proposed windings of the design. A systematic study is carried out to present the design information in terms of inductance and quality factor as a function of physical parameters including number of turns, width of the conductor and separation between the conductors. Footprint comparisons for a given inductance and resonating frequency between conventional spiral inductor designs and the new topology are presented with validation by full-wave EM simulations. Comparisons of compact footprints are explored and simple design patterns are analyzed to reduce overall complications with existing architectures and fabrication. An equivalent circuit model for the new structure is presented with lumped element values extracted using optimization. The new topology is intended to expand the scope of spiral inductors as well as to provide alternative methods for creating compact, high performance solutions for LTCC applications.