Simulation Analysis of Embedded Thin-Film Decoupling Capacitor in Multilayer Packages and PCBs

摘要

This report describes the design guide of the high-performance multi-layer packages and printed circuit boards to reduce power/ground inductive impedance for the high frequency power integrity. The inductive impedance was compared between two types of methods in this study. One is the low inductive decoupling MLCC (Multi Layer Ceramic Capacitor) and the other is the embedded decoupling capacitor with high dielectric constant films. FDTD (finite difference time domain)-method, which is based on EMI (electromagnetic interference) technique, was used for the power integrity simulation. From the results of the simulation, it is observed that the electrical performances of the embedded capacitor boards are better than those of the conventional board with SMT ceramic capacitor only. It is established that the design guide of power integrity as functions of embedded materials and multi-layer package structures in the high frequency range up to 3GHz.