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LASER-INDUCED DAMAGE OF POLYCRYSTALLINE SILICON OPTICALLY POWERED MEMS ACTUATORS

机译:激光诱导的多晶硅光学动力MEMS执行器的损伤

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摘要

Optical MEMS devices are commonly interfaced with lasers for communication, switching, or imaging applications. Dissipation of the absorbed energy in such devices is often limited by dimensional constraints which may lead to overheating and damage of the component. Surface micromachined, optically powered thermal actuators fabricated from two 2.25 μm thick polycrystalline silicon layers were irradiated with 808 nm continuous wave laser light with a 100 μm diameter spot under increasing power levels to assess their resistance to laser-induced damage. Damage occurred immediately after laser irradiation at laser powers above 275 mW and 295 mW for 150 μm diameter circular and 194 μm by 150 μm oval targets, respectively. At laser powers below these thresholds, the exposure time required to damage the actuators increased linearly and steeply as the incident laser power decreased. Increasing the area of the connections between the two polycrystalline silicon layers of the actuator target decreases the extent of the laser damage. Additionally, an optical thermal actuator target with 15 μm × 15 μm posts withstood 326 mW for over 16 minutes without exhibiting damage to the surface.
机译:光学MEMS器件通常与激光器接口,用于通信,切换或成像应用。在这种装置中的吸收能量的耗散通常由尺寸约束限制,这可能导致组件的过热和损伤。用808nm连续波激光照射由两种2.25μm厚的多晶硅层制造的表面微机械的光学动力的热致动器,随着808 nm的连续波激光,在增加功率水平下,在增加的功率水平下,以增加它们对激光诱导的损伤的抵抗力。激光照射在275mW以上的激光照射和295mW的直径为150μm和194μm的圆形椭圆形靶标的后立即发生损坏。在这些阈值以下的激光功率下,随着入射激光功率降低,损坏致动器所需的曝光时间线性和陡峭地增加。增加致动器目标的两个多晶硅层之间的连接面积降低了激光损伤的程度。另外,具有15μm×15μm柱的光学热致动器靶标在326mW以上超过16分钟,而不会对表面造成损坏。

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