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A TLM platform for system-on-chip simulation and verification

机译:用于片上模拟和验证的TLM平台

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The complexity of system-on-chip (SOC) design is been making SOC simulation and verification being a big challenge for SOC designers (Rashinkar et al., 2001). To produce a high quality system in a short design cycle time, system simulation and verification must be done in an affordable time. An integrated environment from transaction level modeling (TLM) to HDL implementation with reusable verification strategy offers a potential solution. In this paper, the authors describe a TLM platform with mixed-language (SystemC/C++- and HDL) simulation capability and reusable verification features supplied to the member universities of the Canadian System-on-Chip Research Network (SOCRN) by Canadian Microelectronics Corporation (CMC). An example is used to illustrate the interface between high-level (SystemC/C++) model and low level (HDL) model for simulation in a mixed language environment.
机译:片上系统(SOC)设计的复杂性是为SOC模拟和验证为SOC设计人员进行了大挑战(Rashinkar等,2001)。为了在简短的设计周期内生产高质量的系统,必须在经济实惠的时间内完成系统仿真和验证。具有可重用验证策略的交易级别建模(TLM)到HDL实现的集成环境提供了潜在的解决方案。在本文中,作者描述了一种具有混合语言(SystemC / C ++ - 和HDL)仿真功能和加拿大微电子公司的成员大学提供的可重复使用的验证功能的TLM平台(CMC)。一个例子用于说明在混合语言环境中的仿真中的高级(SystemC / C ++)模型和低级(HDL)模型之间的接口。

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