Thermoelastic Stress Analysis and Digital Image Correlation to Assess Composites

摘要

A novel methodology for the synchronised capture of white light images for digital image correlation (DIC) and infrared images for thermoelastic stress analysis (TSA) is described. The methodology enables simultaneous data capture without the requirement to pause the cyclic load necessary for the TSA to collect the DIC data. The methodology is demonstrated on cross-ply carbon-epoxy and glass-epoxy specimens that have with and without prior damage and the results from each compared. Various damage types are identified as the damage progresses.