Application of CFD Modelling for Energy Efficient Humidity Management of an Electronics Enclosure in Storage under Severe Climatic Conditions

摘要

A CFD modelling methodology including experimental validation has been developed and applied for investigation of anti-moisture measures in a non-hermetic electronics enclosure containing a number of printed circuit boards, and placed in a severe storage environment. In the climatic test the temperature and the relative humidity have been varied from +33°C to +71°Cand from 14% to 80%, respectively. Enclosure heater solutions have been parametrically studied by simulation. A heating strategy involving various power levels has been determined, which is just sufficient to maintain the internal relative humidity below 60%, thereby reducing the risk for dew formation on the electronics assembly.