WHOLE-FIELD DISPLACEMENT MEASUREMENT WITH MOIRE INTERFEROMETRY AS A BASIS FORA MICROSTRUCTURAL FE MODEL OF A POLYMER BONDED EXPLOSIVE

摘要

Moire interferometry may be used to obtain quantitative displacement information about PBXs. These data have been successfully modelled for the first time, allowing model investigations of various parameter studies to be commenced. By combining sensitive optical displacement measuring techniques with a sophisticated model, significant advances in understanding of the failure processes at work in a PBX have been possible. As noted earlier, the developed methods are thought to be of wide applicability.