Within the last time the customer demand concerning materials with low dissipation factor for a reduced loss along the traces and low dielectric constant for a higher signal propagation speed is steadily increasing. High performance epoxies as Nelco's N4000-13, Isola's FR408 or General Electric's GETEK (similar to Matsushita's MEGTRON) became essential for boards in the higher frequency range. For the past the number of alternatives for applications at even higher frequencies was very limited. These materials, tailored for high frequency use, always showed more or less disadvantages - either in their thermomechanical properties or in their processability within the PCB manufacturing. In the last time a number of new "High Frequency" or "Low Loss" materials from different suppliers was introduced. In an overall relatively small but growing market these ones have to demonstrate their advantages - from electrical, thermomechanical, processing, fabrication quality and/or cost standpoint of view - in comparison to the established ones. The purpose of this paper is to show a comparison of the thermomechanical performance and fabrication quality of new "High Frequency"/"Low Loss" base materials.
展开▼
