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Tin-Bismuth Pre-Plating Technology for Alloy 42 LeadFrames

机译:合金42个引线框架的锡铋预电镀技术

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There are many lead-free finish options such as pure Sn, Sn-Ag, Sn-Bi and Sn-Cu post-mold plating and Pd pre-plating. In the present work, Sn-Bi pre-plating technology for alloy 42 leadframe have been investigated. The electrodeposition was done by two-tone selective plating, namely, Ag was plated on internal lead only and Sn-Bi on external lead using various Sn-Bi plating solution. Surface and cross sectional morphology was observed by SEM. Finally solderability, bending crack and whisker performance after temperature cycles have been evaluated.
机译:有许多无铅饰面选项,如纯SN,SN-AG,SN-BI和SN-CU后模镀层和PD预电镀。在本作工作中,已经研究了用于合金42引线框架的SN-BI预电镀技术。电沉积通过双色调选择性电镀完成,即使用各种Sn-Bi电镀溶液在外部引线上仅在内部引线和Sn-Bi上铺板。通过SEM观察到表面和横截面形态。最后评估了在温度循环后的可焊性,弯曲裂缝和晶须性能。

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