Over the past few years, there has been a growing debate on the benefits of using chromatography versus CVS for plating bath analysis and control. Recent research by the semiconductor industry into copper plating bath technology has further fueled the debate due to the fact that plating technology for electronics and semiconductor applications requires rigid bath control and disciplined methodology. Establishing correlations between what is found in the plated film and bath control parameters is fundamental in producing platings that are consistent and reliable. This paper will compare and contrast the use of chromatography versus CVS for the analysis of a variety of constituents in plating baths.
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