Numerical Derivative Analysis of Load-Displacement Curves in Depth-Sensing Indentation

摘要

The use of load-displacement derivative behavior and power-law curve fitting is applied to find the location of events for a number of different materials during depth-sensing indentation. Load-displacement curves for Berkovich indentations on fused silica, fullerene thin film on sapphire, CdTe thin film on silicon, single crystal silicon, carbide derived carbon, and a polymethylmethacrylate/hydroxyapatite (PMMA/HA) particle composite are examined. The analysis is applied to quantify the location of different events that occur during material loading and unloading.