chip scale packaging; multichip modules; thermal analysis; finite element analysis; thermal management (packaging); natural convection; cooling; heat radiation; standards; circuit simulation; heat conduction; integrated circuit testing; integrated circuit modelling; integrated circuit interconnections; three-die stacked chip scale package; simplified package geometry finite element models; complex package geometry finite element models; thermal performance testing; offset pyramid configuration; stacked Delco thermal test die; die sizes; Delco PST-6; Delco PST-4; Delco PST-2; multi-die power configurations; natural convection environment; radiant heat transfer; convective heat transfer; Theta JA values; Psi JT values; Psi JB values; CSP test samples; JEDEC standard thermal test board; linear superposition matrix equations; multi-die package thermal test data; thermal cross talk; ANSYS finite element analysis modeling software; thermal test configurations; package substrate metal layer trace patterns; simulation accuracy; conductor traces; substrate edge; physically routed trace layers; metal layer trace pattern finite element models; top trace layers; bottom trace layers; 2D thermal conduction elements; CSP package structure; thermal test data; 16 mm; 0.5 mm; 10.16 mm; 6.35 mm; 3.81 mm; 101.5 mm; 114.1 mm; 1.6 mm;
机译:使用有限元建模的3D堆叠IC封装中的芯片封装相互作用
机译:塑料SOIC封装有限元热分析的简化建模技术
机译:一种混合有限元建模:人工神经网络方法,用于预测晶圆级芯片尺度包装中的焊接关节疲劳寿命
机译:3模叠芯片秤包的热试验,包括简化和复杂封装几何有限元模型的评估
机译:倒装芯片封装中水分和热感应应力的有限元分析。
机译:将肌肉骨骼刚体模拟与自适应有限元分析相结合的多尺度建模框架评价股骨几何对髋关节接触力和股骨生长的影响
机译:使用有限差分法TK7874的堆叠芯片级封装(S-Csps)封装过程的建模和分析。 K46 2007 f rb。
机译:光学引导基板,用于堆叠多芯片模块和芯片级封装中的低成本光互连