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FABRICATION AND CHARACTERIZATION OF CONDUCTIVE GLASS COMPOSITES WITH NETWORKS OF SILICON CARBIDE WHISKERS

机译:具有碳化硅晶须网络的导电玻璃复合材料的制造与表征

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In this study, borosilicate glass composites were fabricated using glass microspheres and silicon carbide whiskers (SiCw). These composites have a great deal of potential application in microwave heating and EMI shielding. The microsphere/SiC_w composites were fabricated by hot pressing at relatively low temperatures and pressures in order to control the viscous flow of the glass so that it would segregate the SiCw to specific areas in the composite. This resulted in the formation of percolating SiCw networks at volume fractions around 5-7.5% and a change in about 5-6 orders of magnitude in resistivity, which is typical for these types of composites. Since the SiC_w have a large aspect ratio, the electrical properties were measured in both the parallel and perpendicular direction. Due to the processing method that was intended to form segregated networks, the difference in the resistivity along the two directions was not that large and the small disparities that exist at certain concentrations is likely due to a slight flattening of some of the glass particles due to the hot pressing.
机译:在该研究中,使用玻璃微球和碳化硅晶须(SiCW)制造硼硅酸盐玻璃复合材料。这些复合材料在微波加热和EMI屏蔽中具有很大的潜在应用。通过在相对低的温度和压力下通过热压和压力来制造微球/ SiC_w复合材料,以控制玻璃的粘性流动,使得它将SiCW分离到复合材料中的特定区域。这导致在体积分数下渗透渗透SiCW网络约为5-7.5%,并且在电阻率下的大约5-6个级的变化,这对于这些类型的复合材料是典型的。由于SiC_W具有大的纵横比,因此在平行和垂直方向上测量电性能。由于旨在形成隔离网络的处理方法,沿两个方向的电阻率的差异并不大并且在某些浓度下存在的小视差可能是由于某些玻璃颗粒的轻微平坦而导致的一些浓度热压。

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