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Microparts by a Novel Modification of Selective Laser Sintering

机译:通过新颖的选择性激光烧结改性微粉

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Microparts with a structural resolution of <30μm and aspect ratios of >10 have been generated by selective laser sintering. The technique includes sintering under conditions of vacuum or reduced shield gas pressure. A novel setup and raking procedure is employed; the material is processed by a 1,064 nm Nd-YAG laser. The procedure allows the workpieces to be generated from powders of high melting metals like tungsten as well as lower melting metals like aluminum and copper. Contingent on the parameters, the generated bodies are either firmly attached to the substrate or can be dissevered by a nondestructive method.
机译:通过选择性激光烧结产生具有<30μm和宽高比的结构分辨率的微粉。该技术包括在真空条件下烧结或减少屏蔽气体压力。采用新型设置和耙耙程序;该材料由1,064nm Nd-YAG激光加工。该程序允许工件从钨等高熔点金属的粉末产生,以及铝和铜等熔点金属。取决于参数,产生的主体牢固地连接到基板上,或者可以通过非破坏性方法进行消毒。

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