Aluminum-Silicon Carbide (Al-SiC) Thermal Spreaders Produced by either High-Speed Sheet Stamping or Commercial Die Casting

摘要

Most current microelectronic package thermal spreaders or lids are made of monolithic aluminum, copper, or aluminum -silicon carbide (Al-SiC) which is produced by powder metallurgy or preform infiltraion with molten aluminum. This paper describes two inexpensive processes for the production of Al-SiC thermal spreaders by either (1) high-speed stamping of Al-SiC sheet or (2) conventional die casting. Both processes involve the (a) melting of aluminum, (b) mixing in of a prescribed amount of SiC particles, and (c) casting of either Al-SiC slabs for hot rolling into sheet for stamping or the casting of Al-SiC ingot for subsequent remelting and die casting.