Cost and Size Effective Quad Band Power Amplifier Module using New Impedance Transformation Technique.

摘要

This work describes a new impedance matching technique using interconnects arrangement combined with integrated capacitors for realizing high-Q, wide band and cost effective matching networks. This method allows to eliminate all Surface Mounted Devices (SMD) used in the RF matching networks, reducing significantly the size of the Power Amplifier (PA) solution with an improved manufacturing capability. Thanks to that technique, the MMM5062, a 7x7x1 mm~3 quad-band PA has been designed by Motorola compared to 8x10x1.4 mm~3 standard tri-band solution in the market.